Photonics in SELEX SI: technological capabilities Optical and Microwave Design Simulation of Integrated Optics device performances Simulation of Very high frequency modulation performances Performance Analysis of periodic, quasi-periodic micromachined structures in optical devices Thin Film technologies for optical components TiD and TAPE process tailored for specific device performances Deposition and patterning of Transparent Conductive Oxides (TCO) Deep UV Photolithography LiNbO 3 micromachining Interconnection and packaging technologies Pigtailing Technologies for High Density Interconnects (Ceramic and Plastic Laminate, Flip Chip etc.) Hermetic packaging Integration of Fiber Optic Sub-Systems TDM / WDM Systems Analysis of Thermal issues
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