"""Enabling process : Laser contact opening (LCO)"
{"Image DocumentName": "\u201eEnabling process : Laser contact opening (LCO)", "Image ImageDescription": "Laser open a new dimension of processing: Contact openings. Structuring Si. Drilling Si. Welding interconnections. Deposition. P. Engelhart, S. Hermann, T. Neubere, H. Plagwitz, R. Grischke, R. Meyd, U. Klug, A. Schoonderbeek, U. Stute, and R. Brendel,, Progress in Photovoltaics 15, (2007).", "Image XResolution": "37", "Image YResolution": "37", "Image ResolutionUnit": "Pixels/Centimeter", "Image Software": "SlidePlayer", "Image YCbCrPositioning": "Centered"}