HERMES High Density Integration by Embedding Chips for Reduced Size Modules and Electronic Systems.
{"Image DocumentName": "HERMESHigh Density Integration by Embedding Chips for Reduced Size Modules and Electronic Systems. Please visit:", "Image ImageDescription": "for more information. Project. EU funded project, FP 7 program, Started: May 2008, Duration: 36 month. Total budget (approx.): 16 M\u20ac Project Goal. Industrialization of the results of the HIDING DIES project. Improvement of technology towards finer pitch, use of new material developments, process innovation and equipment improvements. Strong focus on future implementing of the technology in a manufacturing environment / assembly chain. Consortium. 11 partner; technology provider, end-user, testing, research institutes. Early Adopters Group with potential end-users.", "Image XResolution": "37", "Image YResolution": "37", "Image ResolutionUnit": "Pixels/Centimeter", "Image Software": "SlidePlayer", "Image YCbCrPositioning": "Centered"}