4.13: Wire-to-wire joints h. Clean with approved solvent.
{"Image DocumentName": "4.13: Wire-to-wire joints h. Clean with approved solvent.", "Image ImageDescription": "i. Inspect joint according to ECSS-Q-ST j. Position shrink sleeve over joint and shrink to size according to manufacturer\u2019s instructions. Shrink temperature must not exceed melting point of solder. NOTE Configurations described in Annexes I & L can use a wrap-around joint for component lead extension. Position extended wire on the board and bond to board using suitable space-approved adhesive. If lead is longer than 2,5 cm, it shall be bonded along its length at intervals of not more than 2,5 cm. The first spot bond of the extension wire shall be no more than 1,5 cm from the component-to-wire soldered joint.", "Image XResolution": "37", "Image YResolution": "37", "Image ResolutionUnit": "Pixels/Centimeter", "Image Software": "SlidePlayer", "Image YCbCrPositioning": "Centered"}