Wire Bonding Oldest attachment method and still dominant for ICs with < 200 I/Os Oldest attachment method and still dominant for ICs with < 200 I/Os Requires connecting Au or Al wires between IC bonding pads and contact points on the package Requires connecting Au or Al wires between IC bonding pads and contact points on the package ICs are attached to substrate using thermally conductive adhesive with bonding pads facing upward.
{}