Electrical performance
{"Image DocumentName": "Electrical performance", "Image ImageDescription": "TAB interconnections have improved electrical performance. Short circuit lead lengths between the chip and substrate reducing the impedance and signal delays. On the other side, wirebond have long wire loops between the chip and package lead frame, increasing line impedance and signal delays. parameter. wirebond. TAB. Resistance. 0.38m\u03a9. 0.31m\u03a9. Inductance. 10nH. 6.7nH. Capacitance. 0.21pF. 0.11pF.", "Image XResolution": "37", "Image YResolution": "37", "Image ResolutionUnit": "Pixels/Centimeter", "Image Software": "SlidePlayer", "Image YCbCrPositioning": "Centered"}