Will withstand Mil-Std thermal cycling requirements For PBGA Applications – Materials available that will pass MSL Level III For CBGA (HTCC or LTCC) A
{"Image DocumentName": "Flip Chip Application Thermout\u2122", "Image ImageDescription": "Will withstand Mil-Std thermal cycling requirements. For PBGA Applications \u2013 Materials available that will pass MSL Level III. For CBGA (HTCC or LTCC) Applications \u2013 Materials available that will pass MSL Level I. 168 hr. Autoclave. Can be manufactured with a variety of thermally enhanced fillers \u2013 Aln, BN, Ag.", "Image XResolution": "37", "Image YResolution": "37", "Image ResolutionUnit": "Pixels/Centimeter", "Image Software": "SlidePlayer", "Image YCbCrPositioning": "Centered"}