Defects and Failure Mechanisms
{"Image DocumentName": "Defects and Failure Mechanisms", "Image ImageDescription": "processes: litho, etch thin film implantation, planarization, cleaning,\u2026 faults and problems: defects as e.g. particles, flatness, layer properties, patterns, dimensions. challenges. yield and defect map in 2 D. root cause analysis requires 3 D. requires fast and non-destructive inspection (defect density) and metrology (root cause analysis) for 2D and 3D structures \uf0e0 CIA. requires preventive defect and contamination control \uf0e0 WECC. model, predict and forecast yield. ESD Damage. Interconnects. overlay. crack. Metal 2. Via. particle. open. short. Metal 1. particle. layer thickness. p+ n. n+ p. p. COP. n-well. p-well. contamination. interfaces: roughness, state density, charges. Si crystal: stacking faults, contamination, stress, COP (crystal originating particles), epi defects.", "Image XResolution": "37", "Image YResolution": "37", "Image ResolutionUnit": "Pixels/Centimeter", "Image Software": "SlidePlayer", "Image YCbCrPositioning": "Centered"}