CMP Plans and Opportunities
{"Image DocumentName": "CMP Plans and Opportunities", "Image ImageDescription": "No update for Revise 2009 STI tables and text, where necessary. Review and revise timetable and metrics. Review and revise challenges. Review and revise solutions. Review and revise text. Add section for replacement metal gate. Proposed CMP metrics (poly open polish (POP), and metal polish) to be extracted from literature, ISMI, and Sematech. Time table, text, challenges, and solutions. Define post-CMP cleans requirements. Coordinate with Interconnect TWG. Avoid duplication of effort. clarion2\\Spin-off roadshow exhibits\\Spinoff_roadshow_05.ppt. clarion2\\Spin-off roadshow exhibits\\Spinoff_roadshow_05.ppt /27/ :35 PM3/27/ :35 PM. 3/27/ :35 PM3/27/ :35 PM.", "Image XResolution": "37", "Image YResolution": "37", "Image ResolutionUnit": "Pixels/Centimeter", "Image Software": "SlidePlayer", "Image YCbCrPositioning": "Centered"}